Web5 Answers. Whereas most packages are used by several manufacturers, μ MAX seems to be a package solely used by Maxim. It's an 8 pin SMT package, about as wide as an SO-8, but just 3mm long instead of the 5mm of an SO-8. This is achieved by using a 0.65mm pitch instead of 1.27mm. Other manufacturers also go to ever smaller packages, but most ... WebThe Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the …
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WebWe use gold plated interconnects for our pin and through hole converters. Ironwood Electronics offers solder column adapters as a solution for leaded SMT packages such as … WebLe migliori offerte per 20 Pz/Lotto SDK08 Chip Test Clip IC Morsetto TSOP/MSOP/SSOP/TSSOP/SOIC/SOP D2N4 sono su eBay Confronta prezzi e caratteristiche di prodotti ... graham c stores
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WebApr 10, 2024 · Mounts SOIC-14, TSSOP-14 and similar package types. ENIG (Electroless Nickel Immersion Gold) finish. Trace width 0.010″ with 0.020″ width on corner pins. … WebDec 13, 2024 · This is an even smaller version of the SOIC package. Similar to SOIC, the SOP family has a smaller form factor, with pin spacing of less than 1.27mm. Each SOP … This section caters latest news on electronics, technology and related fields. WebJan 14, 2010 · VAPS. Both are surface mount. SOIC = Small Outline IC. This is just a run-of-the-mill surface mount part, usually dual in-line. Lead pitch is 0.98mm. TSSOP = Thin … graham crystal